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ZALM-300 Series
PROCESSING
Recommended Reflow Profile 
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TL
Tpeak
Time within 5o of Tpeak
Time from 25o to Tpeak
Ramp down rate
3o/sec max
150oC
200oC
60-120 sec
217oC
60-150 sec
260 + 0oC
20-30 sec
8 min max
6oC/sec max
Achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate
IPC specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
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Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
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Proper alignment and centering of the module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring pads, or vias.
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